In today’s embedded electronic systems, engineers face a major challenge: integrating more and more functionality into ever-smaller spaces—without sacrificing signal speed or mechanical strength. Until now, this equation has been hard to solve without compromise. Nicomatic’s new Matr’YX connector range changes the game.
Designed for extreme environments—defense, aerospace, and high-performance embedded systems—Matr’YX combines miniaturization, reliability, and performance in one compact solution.
Pack More Without Sacrificing Performance
“We need to connect multiple boards in a tight space, with strict requirements for robustness and speed. Most solutions are too bulky or fall short of expectations.”
This customer feedback is typical of the challenges R&D teams face. Matr’YX was designed precisely to solve this kind of problem.
Equipped with an optimized BGA (Ball Grid Array), our connector offers up to 301 contacts in a 1 mm-pitch high-density grid—while maintaining a compact footprint.
High-Speed, Reliable Connection
Matr’YX isn’t just compact—it delivers impressive data transmission speeds up to 25 Gbps (PAM-4), with low contact resistance (<10 mΩ) and high insulation (≥1 GΩ). These performances are made possible by premium materials, such as a high-temperature LCP insulator and optimized contact geometries.
It ensures stable, interference-free data transmission, even in extreme conditions.
Built Rugged, Validated for Harsh Environments
Matr’YX meets the demanding MIL standards expected in critical applications and has been rigorously tested to ensure robustness:
- Vibration resistance: 30 gRMS from 5 to 2000 Hz
- Extreme temperature cycles: -40 °C to +100 °C
- Humidity and thermal shock resistance
- Mechanical durability: 100 mating/unmating cycles
Real Space Savings for Your Architectures
Available in modular stacking heights from 5.5 to 14.5 mm, the Matr’YX range offers crucial dimensional flexibility for board-to-board integration. The 1.15 mm nominal contact wipe ensures highly reliable connections, even under intense vibration.
In one customer case, Matr’YX replaced two connectors with a single one—reducing space by 15% and simplifying assembly.
Matr’YX at a Glance
- High density: over 70 contacts per cm²
- Up to 301 contacts, standard footprint
- Speeds up to 25 Gbps (PAM-4)
- Configurable stack height: 5.5 to 14.5 mm
- Reliable under harsh environmental conditions
- Compliant with REACH, RoHS
- Compatible with underfill processes for even stricter requirements
- ITAR-free
📍 Meet us at Paris Air Show (Hall 2B, Stand D79), June 16–22, 2025, to discover Matr’YX!
Designing an embedded system where every millimeter matters?
Don’t choose between compactness, performance, and ruggedness—choose Matr’YX.
Contact our expert team to explore the best configuration for your project.